IC packaging & testing

We provide a wide range of IC packaging services, governed by the size and configuration of your component: QFP, QFN, SOP, P-DIP, PLCC, BGA, etc.

Regarding the testing of IC's, our partners will be able to provide professional testing along with detailed reports.

In cooperation with our partner labs, we can provide the following tests:
a. Electrical Testing
b. Solderability
c. Counterfeit Detection
d. X-Ray & X-Ray Fluorescence (XRF)
e. Function Testing
f. Decapsulation


A detailed and professional report is included with each test project.

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